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description the ICX076AK is an interline ccd solid-state image sensor suitable for ntsc color video cameras. this device possesses a number of pixels that is compatible with sif, and offers excellent cost performance due to the adoption of an ultra-small image size and a 10 mm-square 14-pin plastic package. high sensitivity and low dark current are achieved through the use of ye, cy, mg, and g complementary color mosaic filters and through the adoption of had (hole-accumulation diode) sensors. this chip features a field period readout system and an electronic shutter with variable charge- storage time. features high sensitivity and low dark current low smear excellent antiblooming characteristics ye, cy, mg, and g complementary color mosaic filters on chip horizontal register: 5v drive (drive frequency: 6.75mhz) reset gate: 5v drive (no adjustment of bias) device structure image size: diagonal 3.6mm (type 1/5) number of effective pixels: 362 (h) 492 (v) approx. 180k pixels total number of pixels: 381 (h) 506 (v) approx. 190k pixels interline ccd image sensor chip size: 3.75mm (h) 3.30mm (v) unit cell size: 8.10m (h) 4.45m (v) optical black: horizontal (h) direction: front 2 pixels, rear 17 pixels vertical (v) direction: front 12 pixels, rear 2 pixels number of dummy bits: horizontal 14 vertical 1 (even fields only) substrate material: silicon ?1 ICX076AK e95506d99 diagonal 3.6mm (type 1/5) ccd image sensor for ntsc color video cameras sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. aaaaa a aaa a a aaa a a aaa a aaaaa pin 1 v 2 17 2 12 pin 8 h optical black position (top view) 14 pin dip (plastic)
? 2 ICX076AK symbol description pin no. symbol description 1 2 3 4 5 6 7 v f 4 v f 3 v f 2 v f 1 c gg gnd v out vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock output amplifier gate * 1 gnd signal output 8 9 10 11 12 13 14 v dd gnd sub v l rg h f 1 h f 2 supply voltage gnd substrate (overflow drain) protective transistor bias reset gate clock horizontal register transfer clock horizontal register transfer clock : p h o t o s e n s o r n o t e ) v o u t g n d s u b g n d v f 1 v f 4 v f 3 v f 2 v d d r g h f 1 h f 2 v e r t i c a l r e g i s t e r h o r i z o n t a l r e g i s t e r n o t e ) c g g v l 2 3 4 5 6 7 8 9 1 0 1 1 1 2 1 3 1 4 1 c y g c y g c y m g y e m g y e m g y e g c y g c y g c y m g y e m g y e m g y e g block diagram and pin configuration (top view) item ?.3 to +55 ?.3 to +18 ?5 to +12 ?5 to +20 to +12 to +15 to +17 ?7 to +17 ?0 to +15 ?5 to +10 ?5 to +0.3 ?.3 to +27.5 ?.3 to +22.5 ?.3 to +17.5 ?0 to +80 ?0 to +60 v v v v v v v v v v v v v v c c * 2 * 3 ratings unit remarks absolute maximum ratings * 2 +27v (max.) when clock width < 10 s, clock duty factor < 0.1%. * 3 when c gg or gnd (pin 6) are grounded. ?.3 to + 17.5v when c gg and gnd (pin 6) are to be disconnected. substrate voltage sub ?gnd supply voltage clock input voltage voltage difference between vertical clock input pins voltage difference between horizontal clock input pins h f 1 , h f 2 ?v f 4 h f 1 , h f 2 ?gnd h f 1 , h f 2 ?sub v l ?sub v f 1 , v f 3 , v dd , v out ?v l rg ?gnd v f 2 , v f 4 , c gg , h f 1 , h f 2 , gnd ?v l storage temperature operating temperature v dd , v out , c gg ?gnd v dd , v out , c gg ?sub v f 1 , v f 2 , v f 3 , v f 4 ? gnd v f 1 , v f 2 , v f 3 , v f 4 ? sub pin description * 1 dc bias is applied within the ccd, so that this pin should be grounded externally through a capacitance of 1 f or more. pin no.
? 3 ICX076AK item v dd v sub v l 14.25 5.0 indicated voltage ?0.1 15.0 indicated voltage 15.75 12.75 indicated voltage + 0.1 v v v * 1 symbol min. typ. max. unit remarks bias conditions * 2 supply voltage substrate voltage adjustment range substrate voltage adjustment precision protective transistor bias * 1 indications of substrate voltage (v sub ) setting value the setting value of the substrate voltage is indicated on the back of image sensor by a special code. adjust the substrate voltage (v sub ) to the indicated voltage. v sub code ?one character indication - v sub code code and optimal setting correspond to each other as follows. dc characteristics v sub code 5.0 = 5.25 0 5.5 1 5.75 2 6.0 3 6.25 4 6.5 6 6.75 7 7.0 8 7.25 9 7.5 a 7.75 c 8.0 d 8.25 e v sub code 8.5 f 8.75 g 9.0 h 9.25 j 9.5 k 9.75 l 10.0 m 10.25 n 10.5 p 10.75 r 11.0 s 11.25 u 11.5 v 11.75 w v sub code 12.0 x 12.25 y 12.5 z 12.75 ?? ? v sub = 10.0v * 2 v l setting is the v vl voltage of the vertical transfer clock waveform, or the same power supply as the v l power supply for the v driver should be used. * 3 1) current to each pin when 16v is applied to v dd , v out , rg, c gg , gnd (pin 6), and sub pins, while pins that are not tested are grounded. 2) current to each pin when 20v is applied sequentially to v f 1 , v f 2 , v f 3 , and v f 4 pins, while pins that are not tested are grounded. however, 20v is applied to sub pin. 3) current to each pin when 15v is applied sequentially to h f 1 and h f 2 pins, while pins that are not tested are grounded. however, 15v is applied to sub pin. 4) current to v l pin when 25v is applied to v f 1 , v f 3 , v dd , and v out pins or when, 15v is applied to v f 2 , v f 4 , h f 1 , and h f 2 pins, while v l pin is grounded. however, gnd and sub pins are left open. 5) current to gnd pin when 20v is applied to the rg pin and the gnd pin is grounded. * 4 current to sub pin when 55v is applied to sub pin, while all pins that are not tested are grounded. item supply current input current input current i dd i in1 i in2 3 5 1 10 ma a a * 3 * 4 symbol min. typ. max. unit remarks optimal setting optimal setting optimal setting
? 4 ICX076AK item readout clock voltage v vt v vh1 , v vh2 v vh3 , v vh4 v vl1 , v vl2 , v vl3 , v vl4 v f v v vh3 ?v vh v vh4 ?v vh v vhh v vhl v vlh v vll v f h v hl v f rg v rglh ? v rgll v rgh v f sub 14.25 ?.05 ?.2 ?.5 7.3 ?.25 ?.25 4.75 ?.05 4.5 v dd + 0.3 21.25 15.0 0 0 ?.0 8.0 5.0 0 5.0 v dd + 0.6 22.5 15.75 0.05 0.05 ?.5 8.55 0.1 0.1 0.3 0.3 0.3 0.3 5.25 0.05 5.5 0.8 v dd + 0.9 23.75 v v v v v v v v v v v v v v v v v 1 2 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v f v = v vh n ?v vl n (n = 1 to 4) high-level coupling high-level coupling low-level coupling low-level coupling input through 0.01 f capacitance low-level coupling horizontal transfer clock voltage reset gate clock voltage substrate clock voltage vertical transfer clock voltage symbol min. typ. max. unit waveform diagram remarks clock voltage conditions
? 5 ICX076AK clock equivalent circuit constant item capacitance between vertical transfer clock and gnd c f v1 , c f v3 c f v2 , c f v4 c f v12 , c f v34 c f v23 , c f v41 c f v13 , c f v24 c f h1 , c f h2 c f hh c f rg c f sub r 1 , r 2 , r 3 , r 4 r gnd r f h r f rg 520 390 220 150 39 24 18 3 170 100 15 30 39 pf pf pf pf pf pf pf pf pf capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor reset gate clock series resistor symbol min. typ. max. unit remarks r f h r f h h f 2 h f 1 c f h 1 c f h 2 c f h h v f 1 c f v 1 2 v f 2 v f 4 v f 3 c f v 3 4 c f v 2 3 c f v 4 1 c f v 1 3 c f v 2 4 c f v 1 c f v 2 c f v 4 c f v 3 r g n d r 4 r 1 r 3 r 2 v e r t i c a l t r a n s f e r c l o c k e q u i v a l e n t c i r c u i t h o r i z o n t a l t r a n s f e r c l o c k e q u i v a l e n t c i r c u i t r e s e t g a t e c l o c k e q u i v a l e n t c i r c u i t c f r g r g f r f r g
? 6 ICX076AK d r i v e c l o c k w a v e f o r m c o n d i t i o n s ( 1 ) r e a d o u t c l o c k w a v e f o r m ( 2 ) v e r t i c a l t r a n s f e r c l o c k w a v e f o r m i i i i 1 0 0 % 9 0 % 1 0 % 0 % v v t t r t w h t f f m 0 v f m 2 v f 1 v f 3 v f 2 v f 4 v v h h v v h v v h l v v h h v v h l v v h 1 v v l 1 v v l h v v l l v v l v v h h v v h 3 v v h l v v h v v h h v v h l v v l 3 v v l v v l l v v l h v v h h v v h h v v h v v h l v v h l v v h 2 v v l h v v l 2 v v l l v v l v v h h v v h h v v h l v v h 4 v v h l v v h v v l v v l h v v l l v v l 4 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v f v = v vh n ?v vl n (n = 1 to 4)
? 7 ICX076AK (3) horizontal transfer clock waveform t r t w h t f 9 0 % 1 0 % t w l v f h v h l (4) reset gate clock waveform v r g l l v r g l h v r g l + 0 . 5 v v r g l t w l v f r g v r g h p o i n t a r g w a v e f o r m h f 1 w a v e f o r m 1 0 % t r t w h t f v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll ) /2 assuming v rgh is the minimum value during the interval twh, then: v f rg = v rgh ?v rgl
? 8 ICX076AK clock switching characteristics item readout clock vertical transfer clock horizontal transfer clock reset gate clock substrate clock v t v f 1 , v f 2 , v f 3 , v f 4 h f h f 1 h f 2 f rg f sub 2.3 55 25 1.5 2.5 67 5.6 34 1.65 55 67 5.6 107 0.5 9 0.007 0.007 8 18 0.5 15 0.5 7 0.007 0.007 5 250 18 0.5 s ns ns s s ns s during readout * 1 during imaging during parallel-serial conversion during drain charge symbol twh min. typ. max. min. typ. max. min. typ. max. min. typ. max . twl tr tf unit remarks * 1 when vertical transfer clock driver cxd1267 is used. tr and tf are defined by the rise and fall times for 10% to 90% of the interval between v vl and v vh . (5) substrate clock waveform 9 0 % 1 0 0 % 1 0 % 0 % v s u b t r t w h t f f m f m 2 v f s u b
? 9 ICX076AK 8 8 4 9 2 ( v ) 4 4 3 6 2 ( h ) z o n e i i ' e f f e c t i v e p i x e l r e g i o n i g n o r e d r e g i o n image sensor characteristics (ta = 25 c) zone definition of video signal shading measurement system c c d c . d . s l p f 1 l p f 2 s h a m p c c d s i g n a l o u t p u t y s i g n a l o u t p u t c h r o m a s i g n a l o u t p u t ( 3 d b d o w n 4 m h z ) ( 3 d b d o w n 1 m h z ) s h n o t e ) a d j u s t t h e a m p l i f i e r g a i n s o t h a t t h e g a i n b e t w e e n [ * a ] a n d [ * y ] , a n d b e t w e e n [ * a ] a n d [ * c ] e q u a l s 1 . [ * a ] [ * y ] [ * c ] item sensitivity saturation signal smear video signal shading uniformity between video signal channels dark signal dark signal shading flicker y flicker r-y flicker b-y line crawl r line crawl g line crawl b line crawl w lag s ysat sm shy ? sr ? sb ydt ? ydt fy fcr fcb lcr lcg lcb lcw lag 285 700 360 0.007 0.012 25 10 10 2 1 5 5 5 3 3 5 3 0.5 mv mv % % % % mv mv % % % % % % % % 1 2 3 4 5 5 6 7 8 8 8 9 9 9 9 10 ta = 60 c zone ii ta = 60 c ta = 60 c symbol min. typ. max. unit measurement method remarks
? 10 ICX076AK image sensor characteristics measurement method measurement conditions 1) in the following measurements, the substrate voltage is set to the value indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (ob) is used as the reference for the signal output, which is taken as the value of y signal output or chroma signal output of the measurement system. color coding of this image sensor & composition of luminance (y) and chroma (color difference) signals as shown in the left figure, fields are read out. the charge is mixed by pairs such as a1 and a2 in the a field (pairs such as b in the b field). as a result, the sequence of charges output as signals from the horizontal shift register (hreg) is, for line a1, (g + cy), (mg + ye), (g + cy), and (mg + ye). these signals are processed to form the y signal and chroma (color difference) signal. the y signal is formed by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. in other words, the approximation: y = {(g + cy) + (mg + ye)} 1/2 = 1/2 { 2b + 3g + 2r} is used for the y signal, and the approximation: r ?y = {(mg + ye) ?(g + cy)} = {2r ?g} is used for the chroma (color difference) signal. for line a2, the signals output from hreg in sequence are (mg + cy), (g + ye), (mg + cy), (g + ye). the y signal is formed from these signals as follows: y = {(g + ye) + (mg + cy)} 1/2 = 1/2 {2b + 3g + 2r } this is balanced since it is formed in the same way as for line a1. in a like manner, the chroma (color difference) signal is approximated as follows: ?(b ?y) = {(g + ye) ?(mg + cy)} = ?{2b ?g} in other words, the chroma signal can be retrieved according to the sequence of lines from r ?y and ?(b ?y) in alternation. this is also true for the b field. c y y e g m g c y y e g m g c y y e g m g c y y e g m g a 1 a 2 b h r e g c o l o r c o d i n g d i a g r a m
? 11 ICX076AK definition of standard imaging conditions 1) standard imaging condition i : use a pattern box (luminance 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f5.6. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) standard imaging condition ii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity set to standard imaging condition i . after selecting the electronic shutter mode with a shutter speed of 1/250s, measure the y signal (ys) at the center of the screen and substitute the value into the following formula. s = ys [mv] 2. saturation signal set to standard imaging condition ii . after adjusting the luminous intensity to 10 times the intensity with average value of the y signal output, 200mv, measure the minimum value of the y signal. 3. smear set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity to 500 times the intensity with the average value of the y signal output, 200mv. when the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value (ysm [mv]) of the y signal output and substitute the value into the following formula. 4. video signal shading set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the y signal output is 200mv. then measure the maximum (ymax [mv]) and minimum (ymin [mv]) values of the y signal and substitute the values into the following formula. shy = (ymax ?ymin)/200 100 [%] 5. uniformity between video signal channels set to standard imaging condition ii . adjust the luminous intensity so that the average value of the y signal output is 200mv, and then measure the maximum (crmax, cbmax [mv]) and minimum (crmin, cbmin [mv]) values of the r ?y and b ?y channels of the chroma signal and substitute the values into the following formula. ? sr = i (crmax ?crmin)/200 i 100 [%] ? sb = i (cbmax ?cbmin)/200 i 100 [%] 6. dark signal measure the average value of the y signal output (ydt [mv]) with the device ambient temperature 60 c and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. sm = 100 [%] (1/10v method conversion value) 200 ysm 500 1 10 1 60 250
? 12 ICX076AK 7. dark signal shading after measuring 6, measure the maximum (ydmax [mv]) and minimum (ydmin [mv]) values of the y signal output and substitute the values into the following formula. ? ydt = ydmax ?ydmin [mv] 8. flicker 1) fy set to standard imaging condition ii . adjust the luminous intensity so that the average value of the y signal output is 200mv, and then measure the difference in the signal level between fields ( ? yf [mv]). then substitute the value into the following formula. fy = ( ? yf/200) 100 [%] 2) fcr, fcb set to standard imaging condition ii . adjust the luminous intensity so that the average value of the y signal output is 200mv, insert an r or b filter, and then measure both the difference in the signal level between fields of the chroma signal ( ? cr, ? cb) as well as the average value of the chroma signal output (car, cab). substitute the values into the following formula. fci = ( ? ci/cai) 100 [%] (i = r, b) 9. line crawls set to standard imaging condition ii . adjust the luminous intensity so that the average value of the y signal output is 200mv, and then insert a white subject and r, g, and b filters and measure the difference between y signal lines for the same field ( ? ylw, ? ylr, ? ylg, ? ylb [mv]). substitute the values into the following formula. lci = ( ? yli/200) 100 [%] (i = w, r, g, b) 10. lag adjust the y signal output value generated by strobe light to 200mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (ylag). substitute the value into the following formula. lag = (ylag/200) 100 [%] y l a g ( l a g ) y s i g n a l o u t p u t 2 0 0 m v l i g h t f l d s g 1 s t r o b e l i g h t t i m i n g o u t p u t
? 13 ICX076AK c c d o u t h f 1 h f 2 c x d 1 2 6 7 1 / 1 0 v 0 . 0 1 1 0 0 3 . 9 k 8 v 1 m 2 s k 5 2 3 i c x 0 7 6 ( b o t t o m v i e w ) h f 1 h f 2 r g v l s u b g n d v d d v f 4 v f 3 v f 2 v f 1 g n d c g g v o u t 2 2 / 1 6 v 3 . 3 / 1 6 v 3 . 3 / 2 0 v 0 . 0 1 1 5 v v s u b x v 2 x v 1 x s g 1 x v 3 x s g 2 x v 4 r g x s u b 2 2 / 2 0 v 1 / 2 0 v 1 0 0 k 0 . 1 1 / 3 5 v 1 0 0 k 0 . 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 1 2 3 4 5 6 7 8 9 1 0 1 1 1 1 2 1 3 1 4 1 5 0 0 p [ * a ] drive circuit
? 14 ICX076AK 7 0 0 6 5 0 6 0 0 5 5 0 5 0 0 4 5 0 4 0 0 w a v e l e n g t h [ n m ] r e l a t i v e r e s p o n s e 1 . 0 0 . 8 0 . 6 0 . 4 0 . 2 0 . 0 y e c y g m g s p e c t r a l s e n s i t i v i t y c h a r a c t e r i s t i c s ( e x c l u d e s l e n s c h a r a c t e r i s t i c s a n d l i g h t s o u r c e c h a r a c t e r i s t i c s ) s e n s o r r e a d o u t c l o c k t i m i n g c h a r t u n i t : s o d d f i e l d e v e n f i e l d h d v 1 v 2 v 3 v 4 v 1 v 2 v 3 v 4 1 . 6 2 . 5 2 . 1 1 . 3 0 . 3 3 8 . 1 2 . 5
? 15 ICX076AK h d v d f l d s g 1 s g 2 v 1 v 2 v 3 v 4 c c d o u t 6 2 4 7 1 3 5 7 5 3 1 9 8 6 4 2 1 0 4 9 1 4 9 2 c l p 1 4 9 0 4 9 1 4 9 2 drive timing chart (vertical sync)
? 16 ICX076AK h d s h d h 2 h 1 1 7 c l p 1 v 1 v 2 v 3 v 4 s u b s h p r g 1 1 1 0 1 0 3 6 2 1 1 0 2 0 drive timing chart (horizontal sync)
? 17 ICX076AK notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a ground 30w soldering iron and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero cross on/off type and connect it to ground. 3) dust and dirt protection image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. clean glass plates with the following operation as required, and use them. a) perform all assembly operations in a clean room (class 1000 or less). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) installing (attaching) a) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) b) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c o m p r e s s i v e s t r e n g t h 5 0 n c o v e r g l a s s p l a s t i c p a c k a g e 5 0 n 1 . 2 n m t o r s i o n a l s t r e n g t h a a a a a a a a a a a a a a a a a a a a a a a a
? 18 ICX076AK c) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. e) if the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyano- acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) others a) do not expose to strong light (sun rays) for long periods, color filters will be discolored. when high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. in such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. for continuous using under cruel condition exceeding the normal using condition, consult our company. b) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. c) the brown stain may be seen on the bottom or side of the package. but this does not affect the ccd characteristics. d) this package has 2 kinds of internal structure. however, their package outline, optical size, and strength are the same. the cross section of lead frame can be seen on the side of the package for structure a. a a a s t r u c t u r e a s t r u c t u r e b c h i p m e t a l p l a t e ( l e a d f r a m e ) p a c k a g e c r o s s s e c t i o n o f l e a d f r a m e
? 19 ICX076AK package outline unit: mm p a c k a g e s t r u c t u r e 2 . 5 7 . 0 2 . 5 1 . 0 0 . 5 5 . 0 1 4 5 . 0 1 8 . 9 7 1 0 . 0 0 . 1 8 . 9 1 0 . 0 0 . 1 8 1 0 . 1 6 0 t o 9 0 . 2 5 8 1 4 7 1 1 . 7 1 . 7 7 . 0 2 . 5 1 . 0 3 . 3 5 0 . 1 5 2 . 6 3 . 5 0 . 3 1 . 2 7 0 . 3 0 . 4 6 1 . 2 7 1 4 p i n d i p ( 4 0 0 m i l ) 0 . 3 v h c d a b ~ ~ ~ b ' m p a c k a g e m a t e r i a l l e a d t r e a t m e n t l e a d m a t e r i a l p a c k a g e w e i g h t p l a s t i c g o l d p l a t i n g 4 2 a l l o y 0 . 6 g 1 . a i s t h e c e n t e r o f t h e e f f e c t i v e i m a g e a r e a . 2 . t h e t w o p o i n t s b o f t h e p a c k a g e a r e t h e h o r i z o n t a l r e f e r e n c e . t h e p o i n t b ' o f t h e p a c k a g e i s t h e v e r t i c a l r e f e r e n c e . 3 . t h e b o t t o m c o f t h e p a c k a g e , a n d t h e t o p o f t h e c o v e r g l a s s d a r e t h e h e i g h t r e f e r e n c e . 4 . t h e c e n t e r o f t h e e f f e c t i v e i m a g e a r e a r e l a t i v e t o b a n d b ' i s ( h , v ) = ( 5 . 0 , 5 . 0 ) 0 . 1 5 m m . 5 . t h e r o t a t i o n a n g l e o f t h e e f f e c t i v e i m a g e a r e a r e l a t i v e t o h a n d v i s 1 . 6 . t h e h e i g h t f r o m t h e b o t t o m c t o t h e e f f e c t i v e i m a g e a r e a i s 1 . 4 1 0 . 1 0 m m . t h e h e i g h t f r o m t h e t o p o f t h e c o v e r g l a s s d t o t h e e f f e c t i v e i m a g e a r e a i s 1 . 9 4 0 . 1 5 m m . 7 . t h e t i l t o f t h e e f f e c t i v e i m a g e a r e a r e l a t i v e t o t h e b o t t o m c i s l e s s t h a n 4 0 m . t h e t i l t o f t h e e f f e c t i v e i m a g e a r e a r e l a t i v e t o t h e t o p d o f t h e c o v e r g l a s s i s l e s s t h a n 4 0 m . 8 . t h e t h i c k n e s s o f t h e c o v e r g l a s s i s 0 . 7 5 m m , a n d t h e r e f r a c t i v e i n d e x i s 1 . 5 . 9 . t h e n o t c h o f t h e p a c k a g e i s u s e d o n l y f o r d i r e c t i o n a l i n d e x , t h a t m u s t n o t b e u s e d f o r r e f e r e n c e o f f i x i n g .

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